(Reuters) – The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging. (Reporting by Devika Nair in Bengaluru; editing by Jason Neely)
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US announces $1.4 billion support for next-generation semiconductor advanced packaging
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(Reuters) – The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.
(Reporting by Devika Nair in Bengaluru; editing by Jason Neely)